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Omniprobe lift-out grids offer secure mounting of TEM lamellae milled by FIB or SEM/FIB systems. The grids are typically 25 - 30µm thick, with posts designed to ensure reliable attachment of lamellae while providing an unobscured view of each section. All grids are 3mm in diameter.

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  1. FIB lift-out grids. Pack of 25 AGJ460
    These are half-grid lift-out TEM sample holders for FIB applications, made of copper/beryllium.
    In Stock

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    In Stock
  2. Beryllium half-ring lift-out grids. Pack of 10 AGJ425
    Simple beryllium half-ring grid offering low etching rates for applications such as tripod polishing, FIB and ion milling.
    Average lead time: 30 days

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    Average lead time: 30 days
  3. 3 post lift-out grids
    3 post lift-out grids designed for in situ lift-out.
    Average lead time: 1 day

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    Average lead time: 1 day
  4. 4 post lift-out grids
    4 post lift-out grids designed for in situ lift-out.
    Average lead time: 1 to 14 days

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    Average lead time: 1 to 14 days
  5. 5 post lift-out grids, copper. Box of 100 AGJ422
    5 post copper lift-out grids are suitable for in situ lift-out. Copper
    In Stock

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    In Stock
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COVID-19: Please note that while we are working closely with our suppliers to minimise the effect of the COVID-19 pandemic, prices and availability may be subject to change at short notice.
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