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Omniprobe lift-out grids are specifically designed to accept TEM lamellae milled by FIB or SEM/FIB systems. The grids are 25 - 30µm thick, with posts designed to ensure reliable attachment of lamellae while providing an un-obscured view of each section. All grids are 3mm diameter.

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  1. Beryllium half-ring lift-out grids. Pack of 10 AGJ425
    Simple beryllium half-ring grid offering low etching rates for applications such as tripod polishing, FIB and ion milling.
    Average lead time: 26 days

    POA

    Average lead time: 26 days
  2. 3 post lift-out grids
    3 post lift-out grids designed for in situ lift-out.
    Average lead time: 17 days

    POA

    Average lead time: 17 days
  3. 4 post lift-out grids
    4 post lift-out grids designed for in situ lift-out.
    Average lead time: 10 to 41 days

    POA

    Average lead time: 10 to 41 days
  4. 5 post lift-out grids, copper. Box of 100 AGJ422
    5 post copper lift-out grids are suitable for in situ lift-out. Copper
    In Stock

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    In Stock
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LEAD TIMES: Average Lead Times are shown individually in working days for any products not currently in stock. Whilst we regularly update this, actual Lead Times can vary due to supply chain fluctuations.
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