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Omniprobe lift-out grids are specifically designed to accept TEM lamellae milled by FIB or SEM/FIB systems. The grids are 25 - 30 µm thick, with posts designed to ensure reliable attachment of lamellae while providing an un-obscured view of each section. All grids are 3 mm diameter.

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  1. Beryllium half-ring lift-out grids. Pack of 10 AGJ425
    Simple beryllium half-ring grid offering low etching rates for applications such as tripod polishing, FIB and ion milling.
    Average lead time: 29 days

    POA

    Average lead time: 29 days
  2. 3 post lift-out grids
    3 post lift-out grids designed for in situ lift-out.
    Average lead time: 1 day

    POA

    Average lead time: 1 day
  3. 4 post lift-out grids
    4 post lift-out grids designed for in situ lift-out.
    Average lead time: 1 to 13 days

    POA

    Average lead time: 1 to 13 days
  4. 5 post lift-out grids, copper. Box of 100 AGJ422
    5 post copper lift-out grids are suitable for in situ lift-out. Copper
    In Stock

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    In Stock
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