Agar Scientific offers a comprehensive range of chemicals and accessories the embedding of biological and materials specimens.
Embedding stubs, moulds and accessories in various shapes and sizes facilitate reproducible embedding. An extensive selection of resins and embedding compounds and processing reagents provide the optimum choice to suit your type of specimen.
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Demotec 15 plus, cold embedding resinNon-shrinking, expanding cold embedding resin for gap free embedding.Average lead time: 1 to 21 days
POA
Average lead time: 1 to 21 days -
EpoFix ResinA low viscosity epoxy cold mounting system curing at room temperature.Average lead time: 1 dayPOA
Average lead time: 1 day -
VariDur 10VariDur 10 is a high hardness, high viscosity, semi-transparent, acrylic cold mounting compound with superior abrasion resistance and edge retention.Average lead time: 14 daysPOA
Average lead time: 14 days -
SamplKwickSamplKwick® is a semi-transparent, high viscosity rapid curing acrylic cold mounting compound.Average lead time: 14 to 60 daysPOA
Average lead time: 14 to 60 days -
Compression mounting compoundsA range of thermosetting compression mounting compounds for hot compression mounting.Average lead time: 14 daysPOA
Average lead time: 14 days -
EpoxiCureEpoxiCure is a two part, general purpose epoxy resin suitable for heat sensitive specimens due to its low curing temperature (28°C/82 °F).Average lead time: 14 to 30 daysPOA
Average lead time: 14 to 30 days -
EpoThin 2 low viscosity epoxyA free flowing, low viscosity, low shrinkage epoxy resin that is ideal for use with porous and heat sensitive samples.Average lead time: 14 daysPOA
Average lead time: 14 days -
Epokwick fast curing epoxyEpoKwick is a transparent, quick setting epoxy resin that cures in 90 minutes.Average lead time: 14 daysPOA
Average lead time: 14 days -
KonductoMet, 450g AGB8788KonductoMet® is a conductive thermosetting phenolic compression mounting resin with low electrical resistanceAverage lead time: 14 daysPOA
Average lead time: 14 days
