A range of thermosetting compression mounting compounds for hot compression mounting. EpoMet® G is a high hardness, hot mounting epoxy with good edge retention and low shrinkage. EpoMet F is similar to EpoMet G, with very low shrinkage and a finer grain size. ProbeMet® is a fine-grained hot mounting epoxy resin containing copper. The extra fine particles fill small voids and cavities. It has near zero electrical resistance and is ideal for conductive SEM, EDS, WDS, and microprobe analysis. ProbeMet has superior edge retention and good hardness. 1.84 kg per pack.