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Compression mounting compounds

A range of thermosetting compression mounting compounds for hot compression mounting.
All prices exclude VAT.
Name & Code
Grouped product items
Code & Description Availability Price Qty
AGB8784
EpoMet G Moulding Powder (1.85kg)
Average lead time: 13 days
Average lead time: 13 days
POA
POA
AGB8784F
EpoMet Fine Grain Moulding Powder (1.85kg)
Average lead time: 13 days
Average lead time: 13 days
POA
POA
AGB8785
ProbeMet Conductive Moulding Powder (1.85kg)
Average lead time: 13 days
Average lead time: 13 days
POA
POA
Product Description

A range of thermosetting compression mounting compounds for hot compression mounting. EpoMet® G is a high hardness, hot mounting epoxy with good edge retention and low shrinkage. EpoMet F is similar to EpoMet G, with very low shrinkage and a finer grain size. ProbeMet® is a fine-grained hot mounting epoxy resin containing copper. The extra fine particles fill small voids and cavities. It has near zero electrical resistance and is ideal for conductive SEM, EDS, WDS, and microprobe analysis. ProbeMet has superior edge retention and good hardness. 1.84 kg per pack.

Technical DataMSDSDelivery & Returns
LEAD TIMES: Average Lead Times are shown individually in working days for any products not currently in stock. Whilst we regularly update this, actual Lead Times can vary due to supply chain fluctuations.