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PELCO FlipScribe

Precision backside scribing for all materials. 

All prices exclude VAT.
Name & Code
Grouped product items
Code & DescriptionAvailabilityPriceQty
AG54330
PELCO FlipScribe Back-Side Scribing Tool
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POA
POA
AG54331
PELCO FlipScribe Extension for Scribing Large Samples
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POA
POA
AG54332
PELCO FlipScribe Holder for Small Samples from 5-25mm, 200-800 microns in thickness
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POA
POA
AG54333
PELCO FlipScribe Kit for Sample Holding
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POA
POA
AG54334
PELCO FlipScribe Sample Holder for 2" Wafers
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POA
POA
AG54335
PELCO FlipScribe Sample Holder for 3" Wafers
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POA
POA
AG54336
PELCO FlipScribe Sample Holder for 4" Wafers
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POA
POA
AG54338
PELCO FlipScribe Replacement Scribe in Cartridge
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POA
POA
Product Description

The PELCO Flip Scribe takes scribing to a new performance level, making clean, straight scribe lines on the backside to allow the user to accurately cleave front side targets, bonded wafers, glass, sapphire and other substrates. It integrates a robust diamond scribe into a sample platform with a fence guide design. The time required to align and scribe is about 1 minute. It allows users to accurately position the scribe mark relative to features on the front side, visualised either by eye or with a user-supplied high magnification microscope.

The PELCO FlipScribe also offers a quick method for cleanly downsizing large area samples, by the use of a "scribe stop" which allows the operator to define the length of the scribe.

The PELCO FlipScribe is a compact, stable, accurate, fast and low-cost scribing and cleaving solution suitable for any lab; no utilities are required for its operation.

Features & Specifications
Enables accurate cleaving through front side targets with a scribe made on the back side of the substrate
Avoids damaging the front side of the sample
Achieves an accuracy of ±200μm
Maintains a flexibility with respect to sample size and shape
Allows the length of the scribe to be varied from 1 to 100mm
Enables precise and repeatable sample alignment and sizing with a ruler embedded in platform
Retains a capability of scribing bonded crystalline and amorphous wafers and chips for subsequent cleaving
Technical DataDelivery & Returns