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PELCO FlexScribe

Precision topside scribing for all materials. 

All prices exclude VAT.
Name & Code
Grouped product items
Code & DescriptionAvailabilityPriceQty
AG54340
PELCO FlexScribe 200 Front-Side Scribing Tool for up to 200mm Wafers
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POA
POA
AG54342
PELCO FlexScribe 300 Front-Side Scribing Tool for up to 300mm Wafers
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POA
POA
AG54343
Diamond Scribing Wheel for PELCO FlexScribe
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POA
POA
AG54344
Deep Cut Scribing Wheel for PELCO FlexScribe
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POA
POA
AG54346
Standard Replacement Scribing Wheel for PELCO FlexScribe
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POA
POA
AG54345
Double-Sided Ruled Mat for PELCO FlexScribe 200
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POA
POA
AG54348
Double-Sided Ruled Mat for PELCO FlexScribe 300
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POA
POA
Product Description

The PELCO FlexScribe is a super-fast, simple method for downsizing wafers and samples by scribing on the topside. It uses a scribing wheel mounted to a sliding scribing mechanism that always makes a straight scribe. This system is used to scribe a wide variety of materials without restrictions on shape, including glass slides, coverslips, silicon, III-V, sapphire and other crystalline and brittle materials. It can address very small samples down to 5mm up to 200mm wafers for the AG54340 model, and up to 300mm wafers for the AG54342 model.

The standard tungsten carbide cutter installed on the PELCO FlexScribe is great for a wide variety of samples including silicon, glass, GaAs and other crystalline materials. Diamond and deep-cutting scribing wheels are also available.

Indenter Recommendations:
  • AG54346 Tungsten carbide scribing wheel is well suited for general purpose use
  • AG54343 Diamond cutter for very thin glass, tempered glass and hard materials such as sapphire
  • AG54344 Deep cutting wheel, for applications like thick glass or off-axis cleaving
Application Examples: 

Break down wafers

Cleave Strips and dies

Cleave off crystal access

Cleave Glass and Sapphire

Cut coupons for section cleaving

Cleave irregular shapes

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