Agar Scientific

Microscopy and Lab
supplies at your fingertips

Compression mounting compounds

A range of thermosetting compression mounting compounds for hot compression mounting.

A range of thermosetting compression mounting compounds for hot compression mounting. EpoMet® G is a high hardness, hot mounting epoxy with good edge retention and low shrinkage. EpoMet F is similar to EpoMet G, with very low shrinkage and a finer grain size. ProbeMet® is a fine-grained hot mounting epoxy resin containing copper. The extra fine particles fill small voids and cavities. It has near zero electrical resistance and is ideal for conductive SEM, EDS, WDS, and microprobe analysis. ProbeMet has superior edge retention and good hardness. 1.84 kg per pack.

Cat. no. Product Colour Temp Pressure  
      (°C) (bar)  
AGB8784 EpoMet G Black 150 290 Harmful
AGB8784F EpoMet F Black 150 290 Harmful
AGB8785 ProbeMet Bronze 150 290 Harmful

Description Code Unit Qty
EpoMet G Moulding Powder (1.85kg) AGB8784 EA
EpoMet Fine Grain Moulding Powder (1.85kg) AGB8784F EA
ProbeMet Conductive Moulding Powder (1.85kg) AGB8785 EA

Compression mounting compounds

  • Compression mounting compounds