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SEM 300nm reference standard

These 2-D holographic array standards for simultaneous calibration of X and Y axes have unique characteristics that make them easy to use for AFM, STM, Auger, FIB and SEM.
All prices exclude VAT.
Name & Code
Grouped product items
Code & Description Availability Price Qty
AGS1863
300nm calibration standard on 12.5 mm pin stub
Average lead time: 45 days
Average lead time: 45 days
POA
POA
AGS1863A
300nm calibration standard on 10 mm JEOL stub
Average lead time: 45 days
Average lead time: 45 days
POA
POA
AGS1863B
300nm calibration standard on 15 mm Topcon/ISI/ABT stub
Average lead time: 45 days
Average lead time: 45 days
POA
POA
AGS1863C
300nm calibration standard on 15 mm Hitachi stub
Average lead time: 45 days
Average lead time: 45 days
POA
POA
AGS1863D
300nm calibration standard on customer stub *
Average lead time: 45 days
Average lead time: 45 days
POA
POA
AGS1863E
300nm calibration standard on 12.5 mm JEOL stub
Average lead time: 45 days
Average lead time: 45 days
POA
POA
AGS1863U
300nm calibration standard, unmounted
Average lead time: 14 days
Average lead time: 14 days
POA
POA
Product Description
These 2-D holographic array standards for simultaneous calibration of X and Y axes have unique characteristics that make them easy to use for AFM, STM, Auger, FIB and SEM.

There are two pitch sizes available:

The 144nm pitch, two dimensional array is accurate to ±1nm and is suitable for SEM and AFM calibrations. The pattern covers the entire chip enabling thousands of measurements to be made without revisiting the same scan area. The surface comprises aluminium ‘bumps’ on silicon. The bump height is approximately 90nm and width 75nm (not calibrated).

For SEM the 144nm standard works well at all accelerating voltages.

For AFM it can be used in contact, intermittent contact (TappingMode™) and other modes, with image sizes from 250nm to10mm.For AFM the2-D standard is available unmounted or can be mounted on 12 mm steel discs. The pattern is durable and allows for extended scanning in contact mode, which means that calibration and measurements are faster.

The 300 nm pitch reference standard is particularly useful for SEM, Auger and FIB calibrations. It can be used for a wide range of accelerating voltages (1kV - 20kV) and calibrates images from x5000 to x200,000 magnification. It can be also be used for AFM.

The surface structure is aluminium ‘bumps’ on silicon. The bump height is approximately 50nm and width 150nm (not calibrated).

The specimen is supplied with a non-traceable manufacturer’s certificate which states the average pitch based on batch measurements.
Delivery & Returns
COVID-19: Please note that while we are working closely with our suppliers to minimise the effect of the COVID-19 pandemic, prices and availability may be subject to change at short notice.