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Omniprobe lift-out grids offer secure mounting of TEM lamellae milled by FIB or SEM/FIB systems. The grids are typically 25 - 30µm thick, with posts designed to ensure reliable attachment of lamellae while providing an unobscured view of each section. All grids are 3mm in diameter.

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  1. FIB lift-out grids. Pack of 25 AGJ460
    These are half-grid lift-out TEM sample holders for FIB applications, made of copper/beryllium.
    In Stock
    £39.86
    In Stock
  2. Beryllium half-ring lift-out grids. Pack of 10 AGJ425
    Simple beryllium half-ring grid offering low etching rates for applications such as tripod polishing, FIB and ion milling.
    Average lead time: 29 days
    £470.25
    Average lead time: 29 days
  3. 3 post lift-out grids
    3 post lift-out grids designed for in situ lift-out.
    Average lead time: 1 day

    From £237.08

    Average lead time: 1 day
  4. 4 post lift-out grids
    4 post lift-out grids designed for in situ lift-out.
    Average lead time: 1 to 13 days

    From £237.08

    Average lead time: 1 to 13 days
  5. 5 post lift-out grids, copper. Box of 100 AGJ422
    5 post copper lift-out grids are suitable for in situ lift-out. Copper
    In Stock
    £258.88
    In Stock
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