M-Bond 610 is a non-conductive, two-component, solvent-thinned epoxy-phenolic adhesive for high performance applications. It is chemically resistant and provides a thin layer of glue which has good ion milling properties. It is an excellent adhesive for mounting samples for dimpling grinding and for bonding samples to produce high quality cross-sections for TEM or for FIB applications. It has also been found to be useful for bonding specimens to mounts for Vibratome™ sectioning. M-Bond has an extremely wide operating temperature range. The complete kit contains four 14g bottles of resin, four 11g bottles of curing agent, four brush caps for dispensing mixed adhesives, four disposable mixing funnels and a sheet of instructions.
The single mix kit comprises one bottle of resin (14g), one bottle of curing agent (11g), one brush cap for dispensing mixed adhesive and a disposable mixing funnel.
M-Bond 610 is Flammable and an Irritant.