Diamond Wafering Blade, 4" x 0.012" x 1/2" hole, medium/coarse grit - high concentration
Diamond Sectioning / Wafering Blades which can be used on most popular precision sectioning and cutting saws.
ORDER ONLINE - no minimum order value
AGENTS & DISTRIBUTORS - available worldwide
REQUEST QUOTES - fast online pricing
All prices exclude VAT.
Product DescriptionDelivery & Returns
Diamond Sectioning / Wafering Blade
Can be used on most popular precision sectioning and cutting saws.
These competitively priced Smart Cut™ precision diamond wafering blades are designed to provide superior smooth surface quality, low-distortion sectioning and enhanced blade life. The man-made diamond crystals in the Smart Cut™ diamond sectioning blades / wafering blades are oriented in such a way that diamonds are only activated at the exposed layer. As the exposed layer begins to wear out, diamonds in a new layer are activated, keeping up the cutting rate.
More TEM
AperturesCalibration StandardsCalibration Standard - Lattice PlaneCirclip Injector and CirclipsCoated GridsCryo PreparationDiamond Knives - DiATOMEFilamentsGrid Boxes & StorageGrids - Athene by Agar ScientificGrids - AgarGrids - FinderGrids - OmniprobeK-kits for Liquid TEMLight Element Support GridsMaterial ProcessingNanoparticles and Gold ConjugatesPhotographic Films & PapersResin Embedding - AcrylicResin Embedding - EpoxyResin Embedding - London ResinResin Embedding ConsumablesSample HoldersSectioningStainingSupport Films - Carbon Support Films - Forming MaterialsSupport Films - Formvar / PioloformSupport Films - Formvar CarbonSupport Films - GrapheneSupport Films - Holey CarbonSupport Films - Lacey Carbon Support Films - QuantifoilSupport Films - SiliconTissue Processing ChemicalsTissue Processing ConsumablesVacuum Coating MaterialsVacuum Oils & GreasesX-ray Microanalysis Standards