These 2-D holographic array standards for simultaneous calibration of X and Y axes have unique characteristics that make them especially easy to use. The pitch is less than 500nm and the pattern covers the entire die so there is no need to hunt for the scan area. The array of bumps means that the image contrast is high even when the probe tip is slightly dull. The patterns are durable and allow for high contrast scanning in contact mode so that calibration and measurements are faster. They can be used in contact, intermittent contact (TappingMode™) and other modes with image sizes from 250nm to 10mm.
Mounted on 12mm steel disc.