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Diamond wafering blades

A range of wafering blades specifically developed to provide precise and accurate sectioning of metallographic samples. Sizes from 127mm to 203mm diameter.
All prices exclude VAT.
Name & Code
Grouped product items
Code & DescriptionAvailabilityPriceQty
AGB8373
127mm Metal Bonded Diamond Wafer Blade High Concentration
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POA
POA
AGB8374
152mm Metal Bonded Diamond Wafer Blade High Concentration
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POA
POA
AGB8376
127mm Metal Bonded Diamond Wafer Blade Low Concentration
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POA
POA
AGB8377
152mm Metal Bonded Diamond Wafer Blade Low Concentration
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POA
POA
AGB8378
203mm Metal Bonded Diamond Wafer Blade Low Concentration
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POA
POA
AGB8379
127mm Metal Bonded Series 20 High Concentration Wafer Blade
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POA
POA
AGB8380
178mm Metal Bonded Series 20 High Concentration Wafer Blade
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POA
POA
Product Description

A range of wafering blades specifically developed to provide precise and accurate sectioning of metallographic samples. These blades use specially formulated grit sized diamond particles to give accurate cuts without the inconvenience and debris found with conventional thicker abrasive cut-off wheels.

The wafering blades are available with low concentration diamond particles; AGB8376, AGB8377 and AGB8378 or high concentration; AGB8373, AGB8374, AGB8379 and AGB8380

The blades are less than 1mm thick and are ideal for sectioning small specimens. The blades are available in various diameters and diamond concentrations to suit your sample needs.

Standard quality for general use - AGB8373, AGB8374

Standard quality for hard metals, tungsten carbide, glass and ceramics - AGB8376, AGB8377, AGB8378

High quality for aggressive general sectioning of ferrous and non-ferrous materials - AGB8379, AGB8380

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