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Agar Scientific

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Grids - Omniprobe

Omniprobe lift-out grids are specifically designed to accept TEM lamellae milled by FIB or SEM/FIB systems. The grids are 25 - 30 µm thick, with posts designed to ensure reliable attachment of lamellae while providing an un-obscured view of each section. All grids are 3 mm diameter.

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4 Item(s)

  1. Beryllium half-ring lift-out grids

    Beryllium half-ring lift-out grids. Pack of 10

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    Simple beryllium half-ring grid offering low etching rates for applications such as tripod polishing, FIB and ion milling.

    Part no: AGJ425

  2. 3 post lift-out grids

    3 post lift-out grids

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    3 post lift-out grids designed for in situ lift-out.

  3. 4 post lift-out grids

    4 post lift-out grids

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    4 post lift-out grids designed for in situ lift-out.

  4. 5 post lift-out grids

    5 post lift-out grids, copper. Box of 100

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    5 post copper lift-out grids are suitable for in situ lift-out.

    Copper

    Part no: AGJ422

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4 Item(s)