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Diamond lapping films

Diamond lapping films

Dia-Lap Diamond Lapping Film (Continuous and Interrupted) is available for a variety of wet or dry applications and with Pressure Sensitive Adhesive (PSA) or plain backing.

Dia-lap Continuous Diamond Lapping Film Discs are recommended for carbides, ceramics, fiber optics, wafers, microelectronic devices, in addition to petrographic and high hardness metals where critical surface flatness is required. Premium graded continuous diamond particles are resin bonded to highly uniform polyester film resulting in consistent performance for ultimate flatness and finish. Suitable for wet or dry applications with Pressure Sensitive Adhesive (PSA) or Plain Back from 0.1 micron to 30 micron.

Dia-lap Interrupted Diamond Lapping Film Discs or Sheets have a longer life and are recommended for less critical applications requiring more aggressive materials removal. Available in discs and sheets from 0.5 micron to 9 micron.

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