Material embedding

Agar Scientific offers a comprehensive range of chemicals and accessories the embedding of biological and materials specimens.

Embedding stubs, moulds and accessories in various shapes and sizes facilitate reproducible embedding. An extensive selection of resins and embedding compounds and processing reagents provide the optimum choice to suit your type of specimen.

Demotec 15 plus, cold embedding resin
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!NEW!

Non-shrinking, expanding cold embedding resin for gap free embedding.
EpoFix Resin
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A low viscosity epoxy cold mounting system curing at room temperature.
VariDur 10
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VariDur 10 is a high hardness, high viscosity, semi-transparent, acrylic cold mounting compound with superior abrasion resistance and edge retention.
SamplKwick
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SamplKwick® is a semi-transparent, high viscosity rapid curing acrylic cold mounting compound.
Compression mounting compounds
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A range of thermosetting compression mounting compounds for hot compression mounting.
EpoxiCure
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EpoxiCure is a two part, general purpose epoxy resin suitable for heat sensitive specimens due to its low curing temperature (28°C/82 °F).
EpoThin 2 low viscosity epoxy
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A free flowing, low viscosity, low shrinkage epoxy resin that is ideal for use with porous and heat sensitive samples.
Epokwick fast curing epoxy
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EpoKwick is a transparent, quick setting epoxy resin that cures in 90 minutes.
KonductoMet, 450g
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KonductoMet® is a conductive thermosetting phenolic compression mounting resin with low electrical resistance

Part no: AGB8788
TransOptic, 2.3kg
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TransOptic is a fast acting, transparent thermoplastic acrylic mounting material.

Part no: AGB8787
Moulding powders
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A range of moulding powders is available that was developed specifically for use in hot mounting processes.
Scan-Dia embedding system
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The Scan-Dia system offers a complete range of cold setting, metallographic embedding agents and accessories.