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Agar Scientific

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Grids for FIB

Omniprobe lift-out grids offer secure mounting of TEM lamellae milled by FIB or SEM/FIB systems. The grids are typically 25 - 30µm thick, with posts designed to ensure reliable attachment of lamellae while providing an unobscured view of each section. All grids are 3mm in diameter.

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5 Item(s)

  1. Fib lift-out grids

    FIB lift-out grids. Pack of 25

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    These are half-grid lift-out TEM sample holders for FIB applications, made of copper/beryllium.

    Part no: AGJ460

  2. Beryllium half-ring lift-out grids

    Beryllium half-ring lift-out grids. Pack of 10

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    Simple beryllium half-ring grid offering low etching rates for applications such as tripod polishing, FIB and ion milling.

    Part no: AGJ425

  3. 3 post lift-out grids

    3 post lift-out grids

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    3 post lift-out grids designed for in situ lift-out.

  4. 4 post lift-out grids

    4 post lift-out grids

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    4 post lift-out grids designed for in situ lift-out.

  5. 5 post lift-out grids

    5 post lift-out grids, copper. Box of 100

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    5 post copper lift-out grids are suitable for in situ lift-out.

    Copper

    Part no: AGJ422

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5 Item(s)